The vacuum sintering furnace is mainly used for the sintering process of semiconductor components and power rectifier devices. It can be vacuum sintered, gas-shielded and sintered, and is a novel process equipment in the semiconductor special equipment series. It has novel design and convenient operation. Compact, multiple processes can be completed on a single unit. It can also be used in vacuum heat treatment, vacuum brazing and other processes in other fields.
1. Since the mold is generally prepared by the user, the mold material is basically high-purity graphite, and the pressure limit is 40 MPa. It is recommended that the user use it below 30 MPa for safety. Before pressing, the area of the punch and the lower punch should be calculated. Converted into pressure,
The specific formula is as follows:
System allows pressurization (tons) = upper or lower punch area × 30MPa
The company is not responsible for damage to the graphite products such as molds, briquettes, heating elements, and heat preservation screens, such as the blind pressurization.
2. The thermocouple is a tungsten-rhenium type. When used, it will become brittle and cannot be touched. If it is damaged, it should be replaced in time. Its model is W2.
3, winter should pay attention to the problem of warmth of circulating water, otherwise it is prone to water pipe burst.
4. After use, the furnace body should be kept vacuum, because the insulation layer in the furnace is easy to get wet, and the vacuum is kept so that the next vacuum will be faster.
5, due to the complexity of the equipment, it is recommended to use a special person, responsible for the person, strict implementation of pre-training for novices, post-use inspection, operation and use of records and other equipment use regulations.