P4 Vacuum Hot-Pressing Sintering Furnace
Vacuum Hot-Pressing Sintering Furnace combines vacuum/atmosphere, hot press forming and high temperature sintering, suitable for high temperature thermoforming of new materials such as powder metallurgy and functional ceramics, such as applied to the transparent ceramics, industrial ceramics, and alloys composed of refractory metals. Vacuum sintering of materials and high temperature sintering of ceramic materials such as silicon carbide and silicon nitride, can also be used for heat treatment of powders or compacts at temperatures below the melting point of the main components, with the aim of increasing the strength by metallurgical bonding between the particles.
  • Technical Features
    1.Maximum Heating Temperature: 2300℃
    2.Integrated hot press sintering and vacuum sintering in one furnace
    3.Horizontal design with front-open chamber ensures easy loading and removal of mold.
    4.Vacuum degree (10^-3 Pa range) and Inert gas (Ar, He, N2) operation.
    5.Fully automatic operation by PLC and touchscreen HMI.
    6.Simultaneous temperature and pressure control.
    7.Temperature control system based on thermocouple and infrared thermometer.
    8.Safety alarm system for over-pressure and over-temperature.

  • P4 Vacuum Hot-Pressing Sintering Furnace

    Equipment FormHorizontal
    Loading methodHorizontal side loading
    Heating ElementGraphite
    Working Temperature1900℃
    Temperature Accuracy±1℃
    Maximum Outside Diameter of Moldφ400x400mm(D*H)
    Product Diameter≤φ200mm
    Diameter of metal headφ200mm
    Max Displacement300mm
    Pressing DirectionSingle way pressurization ( bottom )
    Ultimate Vacuum5Pa/8.0x10-3Pa(8.0×10-2 torr/8.0×10-5 torr)Optional
    Pressure Rise Rate≤2.0Pa/h
    Cooling Water RequirementWater pressure: 0.2~0.3MPa, water flow: 20M3/ h
    Power RequirementThree-phase / 380V;VHPgr-40/40-2000(P4)Total power: 240KVA (including vacuum furnace power, vacuum generator power, cooling water power, etc.);
  • Application

    Transparent Ceramics, Industrial Ceramics 

    Refractory Metal 

    Cemented Carbide 

    Diffusion bonding of metals or other materials 

  • Graphite mold: for product diameter ≤φ200mm


    Stripper: HD-1 (1T)

    Mold release agent: HR-55 (550ml)

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